3.9 Article

Impact of Aluminum Incorporation into In-Zn-O Active Channel for Highly-Stable Thin-Film Transistor Using Solution Process

期刊

ECS SOLID STATE LETTERS
卷 3, 期 9, 页码 Q44-Q46

出版社

ELECTROCHEMICAL SOC INC
DOI: 10.1149/2.0041409ssl

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资金

  1. National Research Foundation of Korea (NRF) grant - Korea government (MEST) [2014023501, 2013059649]
  2. IT R&D program of MSIP (Ministry of Science, ICT & Future Planning)/KEIT) [10041416]
  3. Korea Communications Agency (KCA) [R0101-14-0133] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
  4. National Research Foundation of Korea [22A20130000119, 2012R1A2A2A02011730, 2013R1A1A2059649] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

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Top-gate Al-In-Zn-O (AIZO) thin-film transistors (TFTs) were fabricated using solution process and their device characteristics were demonstrated. The mu(sat), SS, and on/off ratio of the AIZO TFT post-annealed at 250 degrees C were approximately 0.66 cm(2) V-1 s(-1), 0.24 V/dec, and 2.1 x 10(7). Slight negative shifts in turn on voltage were observed as small as 0.2 and 0.5 V under positive and negative-bias stress tests, respectively. Al incorporation into the IZO channel had important impacts on the annealing process optimization at lower temperature and highly-stable TFT performances. (C) 2014 The Electrochemical Society. All rights reserved.

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