Electroless Deposition of Copper and Silver on Niobium Surfaces

Deposition of copper or silver onto niobium surfaces is possible to achieve at elevated temperatures (above 80 degrees C) from strong alkaline solutions containing Cu(II) or Ag(I) ions at pH higher than 12. This deposition does not require a reducing agent, i.e. process proceeds via galvanic displacement reaction. (c) 2012 The Electrochemical Society. All rights reserved.