期刊
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
卷 4, 期 3, 页码 392-399出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCPMT.2014.2300508
关键词
Antenna-in-package (AiP); circularly polarized (CP); half-mode/quarter-mode substrate integrated waveguide; self-shielded; system-in-package (SiP)
A self-shielded antenna-in-package (AiP) covering IEEE 802.11a band is proposed in this paper, and the antenna is designed using quarter mode substrate integrated waveguide (QMSIW) subarray technology. Electromagnetic interference (EMI) in a system-in-package integrated with AiP is discussed firstly. Electric field distribution of the proposed AiP is simulated, and it shows that the metallic via-holes array in the QMSIW subarray approximates to the electric wall to isolate the electromagnetic field coupling and then to increase the EMI shielding. The operating principle of the proposed antenna is investigated through an isosceles right triangular waveguide. An antenna prototype is fabricated and measured. The measured results match with the simulated and analyzed results very well. It is demonstrated that the proposed QMSIW subarray with metallic via-holes array gives an attractive and promising way to design the AiP with self-shielded property.
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