期刊
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
卷 3, 期 7, 页码 1237-1243出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCPMT.2013.2253609
关键词
Electrothermal simulation; identification techniques; electrical interconnects; macromodeling; signal integrity; thermal impedance
The problem of dynamic electrothermal equivalent extraction for system level and signal integrity analysis is considered in the framework of standard macromodeling techniques. The self-heating and mutual thermal impedances of the embedded elements of the system-preliminarily evaluated via 3-D thermal simulations-are reduced with passive identification methods, and equivalent electrical models are realized with a Foster multiport synthesis scheme. The identification is pursued with a convex optimization approach, which is found to be well suited for the thermal problem. As a case study, the coupled electrothermal analysis of an ultra-thin chip-stacking module including two thinned silicon chips interconnected by a copper line is fully carried out in SPICE.
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