期刊
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
卷 2, 期 5, 页码 799-806出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCPMT.2011.2177524
关键词
Electromagnetic heating; encapsulation; packaging
类别
资金
- European Union [218350, FP7-SME-2007-2]
- Kepar Electronica S.A.
- Camero di Commercio Industria
- Artigianato e Agricoltura di Milano
- Mikrosystemtechnik Baden-Wurttemberg e.V.
- National Microelectronics Institute
- ACI-ecotec GmbH Co. KG
- SEHO Systems GmbH
- ARIES Romania
- Freshfield Microwave Systems
- RF Com
- Ribler GmbH
- Royal Academy of Engineering, U.K.
An open-ended microwave oven system is presented and characterized for the rapid encapsulation of microelectronic components. In situ real-time measurement of the temperature of the curing materials is carried out by an infrared pyrometer integrated in the microwave head of the oven. An automatic computer-controlled closed feedback loop has been used to measure the temperature in the curing material and modulate the system operating power to obtain predefined curing temperature cycles for efficient curing. Uniform curing of the encapsulant material is achieved with typical cure time of similar to 300 s with a ramp rate of 1.66 degrees C/s and a hold period of similar to 100 s. Differential scanning calorimeter based measurement for the curing of the polymer dielectric indicates a near 100% degree of cure.
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