期刊
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
卷 1, 期 12, 页码 1916-1922出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCPMT.2011.2128324
关键词
Assembly; backplanes; displays; OLEDs; printed electronics; transfer-printing
Active-matrix organic light-emitting diode displays have been fabricated using backplanes with transfer-printed microscale silicon integrated circuits (ICs) in place of conventional thin-film transistors. The ICs were fabricated using a commercially available semiconductor foundry process, and the wafers were subsequently processed to prepare the ICs for transfer-printing. The microscale ICs were transfer printed onto glass substrates and interconnected using a single-level, thin-film metallization process. The resulting OLED display exhibited good pixel-to-pixel luminance uniformity, high luminance, excellent controllability and high switching speed. The transfer-printing process achieved good positional accuracy and high yield.
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