4.5 Article

InP/InGaAs Photodetector on SOI Photonic Circuitry

期刊

IEEE PHOTONICS JOURNAL
卷 2, 期 3, 页码 299-305

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JPHOT.2010.2046151

关键词

Optical interconnects; photodetector

资金

  1. European Union
  2. Dutch Ministry of Economic Affairs

向作者/读者索取更多资源

We present an InP-based membrane p-i-n photodetector on a silicon-on-insulator sample containing a Si-wiring photonic circuit that is suitable for use in optical interconnections on Si integrated circuits (ICs). The detector mesa footprint is 50 mu m(2), which is the smallest reported to date for this kind of device, and the junction capacitance is below 10 fF, which allows for high integration density and low dynamic power consumption. The measured detector responsivity and 3-dB bandwidth are 0.45 A/W and 33 GHz, respectively. The device fabrication is compatible with wafer-scale processing steps, guaranteeing compatibility toward future-generation electronic IC processing.

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