期刊
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING
卷 89, 期 2, 页码 83-88出版社
TAYLOR & FRANCIS LTD
DOI: 10.1179/174591911X12956245648983
关键词
Copper-nickel alloy; Electrochemical impedance spectroscopy; Atomic force microscopy; Electrodeposited film
资金
- DRDO New Delhi, India
The preparation of Cu-Ni alloy deposits by a brush plating process, and their corrosion, structure, morphology and composition are addressed. The study reveals that the composition, crystalline size and corrosion potential of the films can be controlled by the bath temperature. X-ray fluorescence analysis confirms that Cu-Ni alloy deposits of stoichiometry Cu50.65Ni49.35, Cu45.11Ni54.89, Cu41.95Ni58.05, Cu30.95Ni69.05 are obtained at 30, 40, 50 and 60 degrees C. X-ray diffraction study reveals that the crystalline size varies in the range of 46 to 21 nm when the deposition temperature is varied from 30 to 60 degrees C. The corrosion study revealed that the alloy deposits at higher temperatures show good corrosion resistance. The surface morphology study shows that the higher temperature deposits have smooth surface morphology and small grain size.nm
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