期刊
THIN SOLID FILMS
卷 529, 期 -, 页码 364-368出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2012.06.030
关键词
Au/Ni(P)/Cu; Submicron Ni(P); Cu6Sn5 spalling; Nanocrystalline Ni-3(Sn,P)
类别
资金
- National Science Council (R.O.C.)
- Taiwan Uyemura Co., Ltd. [NSC100-2221-E155-018-MY3, NSC101-2622-E-155-009-CC3]
The solderability between a Sn-Ag-Cu alloy and a submicron Ni(P) film (0.2 mu m) was examined using a focused ion beam and field-emission transmission electron microscope. The Ni(P) was electrolessly deposited between the Au and Cu layers, which possessed a low P content (less than 5 wt.%) and a nanocrystalline structure. After one typical reflow, the Ni(P) film was mostly eliminated from the interface, where Cu6Sn5 with a significant Ni content [(Cu0.6Ni0.4)(6)Sn-5] nucleated. The subsequent diffusion of Sn to the underlying Cu through molten solder channels among the (Cu0.6Ni0.4)(6)Sn-5 grains yielded a second Cu6Sn5 layer at the (Cu0.6Ni0.4)(6)Sn-5/Cu interface. The removal of Ni from the Ni(P) during soldering reaction allowed P to nucleate as nanocrystalline Ni-3(Sn,P) between the two Cu6Sn5 layers, which subsequently translated into a chain of amorphous P-Sn-O pores. The propagation of the porous P-Sn-O destroyed the stability of (Cu0.6Ni0.4)(6)Sn-5 and drove the compound layer to separate from the second Cu6Sn5 after the third reflow. These observations suggest that the exhaustion of the Ni(P) induced spallation of the compound layer, thereby degrading the reliability of the joining interface. (c) 2012 Elsevier B.V. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据