期刊
THIN SOLID FILMS
卷 519, 期 20, 页码 6639-6644出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2011.01.404
关键词
Atomic layer deposition; Plasma deposition; Device fabrication; Thin film deposition
Atomic layer deposition (ALD) is expected to play an important role in future device fabrication due to various benefits, such as atomic level thickness control and excellent conformality. Plasma enhanced ALD (PE-ALD) allows deposition at significantly lower temperatures with better film properties compared to that of conventional thermal ALD. In addition, since ALD is a surface-sensitive deposition technique, surface modification through plasma exposure can be used to alter nucleation and adhesion. In this paper, characteristics of PE-ALD for various applications in semiconductor fabrication are presented through comparison to thermal ALD. The results indicate that the PE-ALD processes are versatile methods to enable nanoscale manufacturing in emerging applications. (C) 2011 Elsevier B.V. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据