4.4 Article

Improved properties of Pt-HfO2 gate insulator-ZnO semiconductor thin film structure by annealing of ZnO layer

期刊

THIN SOLID FILMS
卷 518, 期 18, 页码 5326-5330

出版社

ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2010.04.004

关键词

Zinc oxide; Hafnium oxide; High-k dielectrics; Oxide semiconductor; Metal-insulator-semiconductor capacitor; Annealing; Sputtering; Atomic layer deposition

资金

  1. Ministry of Education, Science and Technology [2009-0081961, R31-2008-000-10075-0]
  2. KIST [2E21580]
  3. National Research Council of Science & Technology (NST), Republic of Korea [2E21580] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
  4. National Research Foundation of Korea [2010-50170, R31-2008-000-10075-0] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

向作者/读者索取更多资源

Metal-insulator-semiconductor capacitors were fabricated with sputtered ZnO and atomic layer deposited HfO2 as the semiconductor and gate dielectric layers, respectively. From the capacitance-voltage measurements, it was confirmed that pre-deposition annealing of the sputtered ZnO layer at 300 degrees C in air greatly decreased the interfacial trap density (similar to 2 x 10(12) cm(-2) eV(-1)), X-ray photoelectron spectroscopy showed a decrease in the OH bonds adsorbed on the ZnO surface after pre-deposition annealing, which improved the interface property. A very small capacitance equivalent thickness of 1.3 nm was achieved, which decreased the operation voltage (<5V) of the device significantly. (C) 2010 Elsevier B.V. All rights reserved.

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