期刊
THIN SOLID FILMS
卷 516, 期 16, 页码 5527-5530出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2007.07.109
关键词
high-entropy alloy; diffusion barriers; amorphous structure; thermal stability
The application of an AlMoNbSiTaTiVZr high-entropy alloy film as diffusion barrier for copper metallization has been investigated. The AlMoNbSiTaTiVZr and copper layers are deposited sequentially, without breaking vacuum, onto silicon substrates by DC magnetron sputtering. The AlMoNbSiTaTiVZr films are found to possess a stable amorphous structure due to their high-entropy and limited diffusion kinetics. The AlMoNbSiTaTiVZr high entropy alloy film is determined to prevent copper-silicide formation up to 700 degrees C for 30 min. Thus, HEAs appear to have potential use as effective diffusion barriers for copper metallization. (c) 2007 Elsevier B.V. All rights reserved.
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