期刊
THIN SOLID FILMS
卷 516, 期 12, 页码 4307-4311出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2007.12.095
关键词
thin films; chromel; annealing; diffusion bonding; interdiffusion; dielectric; materials characterizations
Metal embedded thin film thermocouples are very attractive for various applications in harsh environments. One promising technique to embed thin films micro sensors is diffusion bonding, which requires high temperatures and pressures typically in a vacuum. In this study, high temperature annealing effects on chromel (Ni90Cr10) thin film, an important sensor material as one of the components in type K thermocouple, were investigated in a diffusion bonding environment. Annealing was carried out at 800 degrees C for one hour in a diffusion bonder under vacuum without applying pressure. Under such conditions; surface, interface and interdiffusion phenomena were investigated using different characterization techniques including X-ray Diffraction, X-ray Photoelectron Spectroscopy, Scanning Electron Microscopy, and Energy Dispersive Spectroscopy. Results indicate that the present combination of dielectrics is quite reliable and Ni90Cr10 films of 500 nm thickness can be used for applications at least up to 800 degrees C due to a protective thin chromium oxide layer formation on top of the sensor film during annealing. (c) 2007 Elsevier B.V. All rights reserved.
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