期刊
THERMOCHIMICA ACTA
卷 575, 期 -, 页码 244-253出版社
ELSEVIER
DOI: 10.1016/j.tca.2013.11.003
关键词
Silicon modified phenolic resins; Non-isothermal curing; Model-free isoconversional method; Thermal resistance property
资金
- special funds for key innovation teams of Zhejiang Province [2009R50016]
- Science and Technology Department of Zhejiang Province, P.R. China
- China Scholarship Council [[2012]2013]
- Program for Changjiang Scholars and Innovative Research Team in University [IRT09412]
A silicone-contained biphenol type monomer, 4,4'-(1,3-dipropyl-tetramethyldisiloxane)bis-2-methoxyphenol(SIE), was used to modify phenolic novolac resin by being copolymerized with phenol and formaldehyde to yield SIE-modified phenolic resins (SPNs). The curing behavior of SPNs with hexamethyleneteramine (HMTA) was analyzed by DSC tests, and the non-isothermal curing kinetics were analyzed using the model-fitting and model-free isoconversional methods. Then, SPN/HMTA was used as the resin matrix, while surface-treated chopped sisal fiber was used as the reinforced filler to produce the silicon modified phenolic molding composites (SIEC). The finished composites expressed improved mechanical and thermal resistance properties compared with unmodified composites. (C) 2013 Elsevier B.V. All rights reserved.
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