期刊
SURFACE SCIENCE
卷 605, 期 1-2, 页码 46-53出版社
ELSEVIER
DOI: 10.1016/j.susc.2010.09.020
关键词
Molecular dynamic; Ionized cluster beam deposition; Atomic stress; Surface roughness; Tight-binding potential
资金
- National Science Council of Taiwan [NSC 099-2811-E-151-001, NSC 96-2628-E-151-004-MY3]
A molecular dynamic method is used to simulate the film growth process of Fe or Co clusters depositing on Cu substrate with low energy. The tight-binding (TB-SMA) many-body potential is used to simulate the interaction between atoms. The effects of different incident energies and/or substrate temperatures on the surface roughness, layer coverage function, radial distribution function (RDF), and residual stress are investigated. From the simulation results, as the substrate temperature and/or incident energy is increased, the surface roughness of the grown film could be reduced, and the interface intermixing is increased. Also, as compared to Co-Cu system, Fe-Cu system has better surface roughness, less interface intermixing, and similar radial distribution function as well as average stresses. (C) 2010 Elsevier B.V. All rights reserved.
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