4.7 Article

A numerical model of severe shot peening (SSP) to predict the generation of a nanostructured surface layer of material

期刊

SURFACE & COATINGS TECHNOLOGY
卷 204, 期 24, 页码 4081-4090

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ELSEVIER SCIENCE SA
DOI: 10.1016/j.surfcoat.2010.05.035

关键词

Severe shot peening (SSP); Nanocrystalline structure; Finite element; Residual stresses; Equivalent plastic strain; Severe plastic deformation

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Generation of a surface layer of material characterized by grains with dimensions up to 100 nm by means of severe plastic deformation is one of the most interesting methods to improve the mechanical behaviour of materials and structural elements. Among the ways to obtain a surface layer with this characteristic, shot peening is one of the most promising processes, since it is applicable to very general geometries and to all metals and metal alloys without high-tech equipments. Notwithstanding the fact that the ability of shot peening to obtain nanostructured surfaces by using particular process parameters (mainly high impact energy and long exposure time) is proved, deep knowledge of the correct choice of quantitative values of process parameters and their relation to the grain size and the thickness and uniformity of the nanostructured layer is still lacking. In this paper a finite element model of severe shot peening (SSP) is developed with the aim of predicting the treatment conditions that lead to surface nanocrystallization. After having assessed the accuracy of the model as regards mesh parameters and constitutive law of the material, the results are discussed and interpreted in terms of induced residual stresses and surface work hardening. A method to assess the formation of nanostructured layer of materials based on the value of the equivalent plastic strain is developed. The comparison with experimental results allow to affirm that the model is a useful tool to predict the generation of a nanostructured surface layer by shot peening and to relate the peening parameters with the treated surface layer in terms of residual stresses, work hardening, and depth of the nanostructured layer. (C) 2010 Elsevier B.V. All rights reserved.

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