期刊
SOFT MATTER
卷 8, 期 33, 页码 8690-8696出版社
ROYAL SOC CHEMISTRY
DOI: 10.1039/c2sm26017d
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资金
- Israel Science Foundation [1293/08]
- Edmond J. Safra Foundation through the Biopolymers Center
- EPSRC [EP/G030952/1, EP/G026203/1]
- Converging Technology Fellowship of the Planning and Budgeting Committee
- Council for Higher Education, Israel
- Kreitman Fellowship for doctoral research
- Royal Society-Wolfson Research Merit Award
- EPSRC [EP/G026203/1, EP/G030952/1, EP/F048114/1] Funding Source: UKRI
- Engineering and Physical Sciences Research Council [EP/G030952/1, EP/G026203/1, EP/F048114/1] Funding Source: researchfish
Controlling the morphology of self-assembled peptide nanostructures, particularly those based on amyloid peptides, has been the focus of intense research. In order to exploit these structures in electronic applications, further understanding of their electronic behavior is required. In this work, the role of peptide morphology in determining electronic conduction along self-assembled peptide nanofilament networks is demonstrated. The peptides used in this work were based on the sequence AAKLVFF, which is an extension of a core sequence from the amyloid beta peptide. We show that the incorporation of a non-natural amino acid, 2-thienylalanine, instead of phenylalanine improves the obtained conductance with respect to that obtained for a similar structure based on the native sequence, which was not the case for the incorporation of 3-thienylalanine. Furthermore, we demonstrate that the morphology of the self-assembled structures, which can be controlled by the solvent used in the assembly process, strongly affects the conductance, with larger conduction obtained for a morphology of long, straight filaments. Our results demonstrate that, similar to natural systems, the assembly and folding of peptides could be of great importance for optimizing their function as components of electronic devices. Hence, sequence design and assembly conditions can be used to control the performance of peptide based structures in such electronic applications.
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