Contactless ultrasonic energy transfer for wireless systems: acoustic-piezoelectric structure interaction modeling and performance enhancement

There are several applications of wireless electronic components with little or no ambient energy available to harvest, yet wireless battery charging for such systems is still of great interest. Example applications range from biomedical implants to sensors located in hazardous environments. Energy transfer based on the propagation of acoustic waves at ultrasonic frequencies is a recently explored alternative that offers increased transmitter-receiver distance, reduced loss and the elimination of electromagnetic fields. As this research area receives growing attention, there is an increased need for fully coupled model development to quantify the energy transfer characteristics, with a focus on the transmitter, receiver, medium, geometric and material parameters. We present multiphysics modeling and case studies of the contactless ultrasonic energy transfer for wireless electronic components submerged in fluid. The source is a pulsating sphere, and the receiver is a piezoelectric bar operating in the 33-mode of piezoelectricity with a fundamental resonance frequency above the audible frequency range. The goal is to quantify the electrical power delivered to the load (connected to the receiver) in terms of the source strength. Both the analytical and finite element models have been developed for the resulting acoustic-piezoelectric structure interaction problem. Resistive and resistive-inductive electrical loading cases are presented, and optimality conditions are discussed. Broadband power transfer is achieved by optimal resistive-reactive load tuning for performance enhancement and frequency-wise robustness. Significant enhancement of the power output is reported due to the use of a hard piezoelectric receiver (PZT-8) instead of a soft counterpart (PZT-5H) as a result of reduced material damping. The analytical multiphysics modeling approach given in this work can be used to predict and optimize the coupled system dynamics with very good accuracy and dramatically improved computational efficiency compared to the use of commercial finite element packages.