期刊
SMALL
卷 5, 期 11, 页码 1246-1257出版社
WILEY-V C H VERLAG GMBH
DOI: 10.1002/smll.200801551
关键词
interconnects; nanoelectronics; nanomaterials; nanosoldering; self-assembly
类别
资金
- NSF Center
- Massachusetts Toxics Use Reduction Institute (TURI)
Interconnect formation is critical for the assembly and integration of nanocomponents to enable nanoelectronics- and nanosystems-related applications. Recent progress on joining and interconnect formation of key nanomaterials, especially nanowires and carbon nanotubes, into functional circuits and/or prototype devices is reviewed. The nanosoldering technique through nanoscale lead-free solders is discussed in more detail in this Review. Various strategies of fabricating lead-free nanosolders and the utilization of the nanosoldering technique to form functional solder joints are reviewed, and related challenges facing the nanosoldering technique are discussed. A perspective is given for using lead-free nanosolders and the nanosoldering technique for the construction of complex and/or hybrid nanoelectronics and nanosystems.
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