期刊
SENSORS AND ACTUATORS A-PHYSICAL
卷 173, 期 1, 页码 238-243出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.sna.2011.09.040
关键词
Millimeter-wave antenna; Wafer level packaging; Coplanar waveguide fed aperture; MEMS; MMIC
This paper presents a technological process compatible process compatible with an above integrated circuit (IC) to achieve a millimeter wave antenna structure that is well-suited for wafer level packaging technology. The radiating patch is introduced inside of the air cavity of packaging. This structure consists of two dielectric substrates and benzocyclobutene (BCB) sealing rings at the wafer level. The wafer level packaging that holds the radiating patch is made of Pyrex, a low permittivity substrate. The millimeter-wave antenna using the micromachining technology is excited by a coplanar waveguide fed aperture (CPWFA). This feeding mechanism is designed and realized on GaAs, a high permittivity substrate. The electromagnetic energy of the CPWFA to the radiating patch is made through a coupling slot. The fabricated antenna of 6 mm x 6 mm, including the ground plane, exhibits a 10 dB bandwidth of 3 GHz from 50.5 GHz to 53.5 GHz. The design has been driven by the interest of collective encapsulation of MEMS and MMICs devices. (C) 2011 Elsevier B.V. All rights reserved.
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