期刊
SCRIPTA MATERIALIA
卷 67, 期 2, 页码 177-180出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2012.04.010
关键词
Tri-phase immiscible nanocomposites; Thermal stability; Hardness; Nanocrystalline metals
类别
资金
- US Army Research Office-Materials Science Division [W911NF-09-1-0223]
- DOE-NEUP [DE-AC07-05ID14517-00088120]
- NSF [1129065]
The thermal stability of sputtered Co-Cu-Ag tri-phase immiscible nanocomposites (TPINs) was compared to nanocrystalline Cu50Ag50 and monolithic Cu. After annealing at 973 K, the grain size of Co34Cu33Ag33 was similar to 115 nm, whereas that of Cu50Ag50 increased to over 700 nm. The hardness of annealed Co34Cu33Ag33 TPIN remained high, similar to 3 GPa, comparing to only 1.0 GPa for Cu50Ag50 film. The remarkable thermal stability of the TPIN is largely achieved via the introduction of a third immiscible phase, forming abundant tri-phase triple junctions. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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