期刊
SCRIPTA MATERIALIA
卷 64, 期 7, 页码 633-636出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2010.12.006
关键词
Annealing; Soldering; Intermetallic compounds; Lead-free solder
类别
资金
- National Science Council of Taiwan, ROC
Cu5Zn8 phase was formed at the Sn-9 wt.% Zn/Cu interface after reflow, but this phase fractured very severely during subsequent solid-state annealing. By reducing the cooling rate of the reflow process, a thicker Cu5Zn8 phase was formed and the phase fracture was retarded during subsequent annealing, which retained the integrity of the Cu5Zn8 phase at the interface. The improvement in the Cu5Zn8 phase integrity was attributed to the maintenance of a local equilibrium at the interface. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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