期刊
SCRIPTA MATERIALIA
卷 59, 期 2, 页码 251-254出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2008.03.022
关键词
thin films; fracture; grain boundaries; toughness
Through a set of microtensile experiments, it was discovered that the resistance of a free-standing polycrystalline silicon thin film to cleavage cracking is not a material constant. Rather, it is highly dependent on the film thickness. As the film thickness changes from 1 to 10 mu m, the fracture resistance increases by 20-60%, which can be attributed to the nonuniform nature of the crack front advance across grain boundaries. (c) 2008 Published by Elsevier Ltd. on behalf of Acta Materialia Inc.
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