4.7 Review

Review of prediction for thermal contact resistance

期刊

SCIENCE CHINA-TECHNOLOGICAL SCIENCES
卷 53, 期 7, 页码 1798-1808

出版社

SCIENCE PRESS
DOI: 10.1007/s11431-009-3190-6

关键词

thermal contact resistance; thermal contact conductance; surface topography; deformation assumption; prediction model; numerical simulation

资金

  1. School of Astronautics, Beihang University

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Theoretical prediction research on thermal contact resistance is reviewed in this paper. In general, modeling or simulating the thermal contact resistance involves several aspects, including the descriptions of surface topography, the analysis of micro mechanical deformation, and the thermal models. Some key problems are proposed for accurately predicting the thermal resistance of two solid contact surfaces. We provide a perspective on further promising research, which would be beneficial to understanding mechanisms and engineering applications of the thermal contact resistance in heat transport phenomena.

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