期刊
SCIENCE CHINA-TECHNOLOGICAL SCIENCES
卷 53, 期 7, 页码 1798-1808出版社
SCIENCE PRESS
DOI: 10.1007/s11431-009-3190-6
关键词
thermal contact resistance; thermal contact conductance; surface topography; deformation assumption; prediction model; numerical simulation
资金
- School of Astronautics, Beihang University
Theoretical prediction research on thermal contact resistance is reviewed in this paper. In general, modeling or simulating the thermal contact resistance involves several aspects, including the descriptions of surface topography, the analysis of micro mechanical deformation, and the thermal models. Some key problems are proposed for accurately predicting the thermal resistance of two solid contact surfaces. We provide a perspective on further promising research, which would be beneficial to understanding mechanisms and engineering applications of the thermal contact resistance in heat transport phenomena.
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