Effect of pH on the electrodeposition kinetics of copper from acetate and sulfosalicylate complex solutions

A method was proposed for the calculation of partial currents that characterize the discharge of individual complex copper ions in acetate and sulfosalicylate solutions. The reaction rate constants for the electrodeposition of different forms of the copper complexes were determined using this method and results of the analytical calculation of the solution compositions depending on the pH. Fine-grained deposits with high adhesion to the surface were obtained from acetate (pH 4.7) and sulfosalicylate (pH 6.6) solutions in which the electrodeposition proceeds at high polarization due to low discharge rate constants of the anionic copper complexes.