期刊
REVIEW OF SCIENTIFIC INSTRUMENTS
卷 81, 期 1, 页码 -出版社
AMER INST PHYSICS
DOI: 10.1063/1.3277117
关键词
bonds (chemical); borosilicate glasses; cooling; elemental semiconductors; heating; silicon; thermal conductivity
资金
- Danish National Research Foundation
Anodic bonding of silicon to glass always involves heating the glass and device to high temperatures so that cations become mobile in the electric field. We present a simple way of bonding thin silicon samples to borosilicate glass by means of heating from the glass side while locally cooling heat-sensitive areas from the silicon side. Despite the high thermal conductivity of silicon, this method allows a strong anodic bond to form just millimeters away from areas essentially at room temperature.
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