期刊
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
卷 5, 期 2, 页码 168-181出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCPMT.2014.2337300
关键词
Encapsulant; high-temperature; plastic integrated circuit packaging; power electronic packaging; semiconductor device packaging
类别
资金
- High Density Integration (HDI) mini-consortium of the Center for Power Electronics Systems (CPES) at Virginia Tech.
Semiconductor encapsulation is crucial to electronic packaging because it provides protection against mechanical stress, electrical breakdown, chemical erosions, a radiations, and so on. Conventional encapsulants are only applicable below 150 degrees C. However, with increasing demand for high-density and high-temperature packaging, encapsulants that are functional at or above 250 degrees C are required. In this paper, five types of encapsulants, including conformal coatings, underfills, molding compounds, potting compounds, and glob tops, are surveyed. First, recommended properties and selection criteria of each type of encapsulant are listed. Second, standard test methods for several crucial properties, including glass-transition temperature (T-g), coefficient of thermal expansion (CTE), dielectric strength, and so on are reviewed. Afterward, commercial products with high-operation temperature are surveyed. However, the results of the survey reveal a lack of high-temperature encapsulants. Therefore, this paper reviews recent progress in achieving encapsulants with both high-temperature capability and satisfactory properties. Material compositions other than epoxy, such as polyimide (PI), bismaleimide (BMI), and cyanate ester (CE), are potential encapsulants for high-temperature (250 degrees C) operation, although their CTE needs to be tailored to limit internal stress. Fillers are reported to be efficient in reducing the CTE. In addition, fillers may also have a beneficial impact on the thermal stability of silicone-based encapsulants, whose high-temperature capability is limited by their thermal instability.
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