相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。Size and rate dependent necking in thin metallic films
T. Pardoen
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS (2014)
Inter- and intragranular plasticity mechanisms in ultrafine-grained Al thin films: An in situ TEM study
F. Mompiou et al.
ACTA MATERIALIA (2013)
Automatic Crystallographic Characterization in a Transmission Electron Microscope: Applications to Twinning Induced Plasticity Steels and Al Thin Films
M. Galceran et al.
MICROSCOPY AND MICROANALYSIS (2013)
The effect of dislocation density on the interactions between dislocations and twin boundaries in nanocrystalline materials
S. Ni et al.
ACTA MATERIALIA (2012)
High strength-ductility of thin nanocrystalline palladium films with nanoscale twins: On-chip testing and grain aggregate model
M. -S. Colla et al.
ACTA MATERIALIA (2012)
Advanced TEM investigation of the plasticity mechanisms in nanocrystalline freestanding palladium films with nanoscale twins
B. Wang et al.
INTERNATIONAL JOURNAL OF PLASTICITY (2012)
Deformation twinning in nanocrystalline materials
Y. T. Zhu et al.
PROGRESS IN MATERIALS SCIENCE (2012)
On-chip stress relaxation testing method for freestanding thin film materials
M. Coulombier et al.
REVIEW OF SCIENTIFIC INSTRUMENTS (2012)
Ultrahigh Strain Hardening in Thin Palladium Films with Nanoscale Twins
Hosni Idrissi et al.
ADVANCED MATERIALS (2011)
Measuring time-dependent deformations in metallic MEMS
L. I. J. C. Bergers et al.
MICROELECTRONICS RELIABILITY (2011)
Strain rate sensitivity of nanocrystalline Au films at room temperature
K. Jonnalagadda et al.
ACTA MATERIALIA (2010)
In situ TEM study of microplasticity and Bauschinger effect in nanocrystalline metals
Jagannathan Rajagopalan et al.
ACTA MATERIALIA (2010)
In Situ Observation of Dislocation Behavior in Nanometer Grains
Lihua Wang et al.
PHYSICAL REVIEW LETTERS (2010)
New On-Chip Nanomechanical Testing Laboratory - Applications to Aluminum and Polysilicon Thin Films
Sebastien Gravier et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2009)
Strong Strain Hardening in Nanocrystalline Nickel
X. L. Wu et al.
PHYSICAL REVIEW LETTERS (2009)
Internal stress relaxation based method for elastic stiffness characterization of very thin films
A. Boe et al.
THIN SOLID FILMS (2009)
Analysis of a passive sensor for predicting. process-induced stress in advanced integrated circuit interconnect
Barry J. Gallacher et al.
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY (2008)
Toward a quantitative understanding of mechanical behavior of nanocrystalline metals
M. Dao et al.
ACTA MATERIALIA (2007)
On the formation mechanisms, spatial resolution and intensity of backscatter Kikuchi patterns
S. Zaefferer
ULTRAMICROSCOPY (2007)
Temperature-dependent strain rate sensitivity and activation volume of nanocrystalline Ni
Y. M. Wang et al.
ACTA MATERIALIA (2006)
Mechanical properties of nanocrystalline materials
MA Meyers et al.
PROGRESS IN MATERIALS SCIENCE (2006)
Mechanistic models for the activation volume and rate sensitivity in metals with nanocrystalline grains and nano-scale twins
RJ Asaro et al.
ACTA MATERIALIA (2005)
Nano-sized twins induce high rate sensitivity of flow stress in pure copper
L Lu et al.
ACTA MATERIALIA (2005)
Characterisation of fine-scale microstructures by electron backscatter diffraction (EBSD)
FJ Humphreys
SCRIPTA MATERIALIA (2004)
Thin films stress extraction using micromachined structures and wafer curvature measurements
J Laconte et al.
MICROELECTRONIC ENGINEERING (2004)
Activation volume for inelastic deformation in polycrystalline Ag thin films
MJ Kobrinsky et al.
ACTA MATERIALIA (2000)