期刊
POLYMERS FOR ADVANCED TECHNOLOGIES
卷 23, 期 6, 页码 1025-1028出版社
WILEY
DOI: 10.1002/pat.2063
关键词
epoxy resin; boron nitride; thermal conductivity
资金
- Northwestern Polytechnical University [JC20100219]
Boron nitride (BN) micro particles modified by silane coupling agent, ?-aminopropyl triethoxy silane (KH550), are employed to prepare BN/epoxy resin (EP) thermal conductivity composites. The thermal conductivity coefficient of the composites with 60% mass fraction of modified BN is 1.052?W/mK, five times higher than that of native EP (0.202?W/mK). The mechanical properties of the composites are optimal with 10?wt% BN. The thermal decomposition temperature, dielectric constant, and dielectric loss increase with the addition of BN. For a given BN loading, the surface modification of BN by KH550 exhibits a positive effect on the thermal conductivity and mechanical properties of the BN/EP composites. Copyright (C) 2011 John Wiley & Sons, Ltd.
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