Soy Protein/Clay Bionanocomposites as Ideal Packaging Materials

Soy protein-based bionanocomposites were prepared via solution intercalation with incorporation of the organoclay of different concentrations. The composites were characterized through UV-Visible and Fourier Transform Infrared (FTIR) spectroscopy, X-ray Diffraction (XRD) and Transmission Electron Microscopy (TEM). Thermal resistance of the materials was assessed by thermogravimetric analysis (TGA). The results showed a significant improvement in thermal resistance and glass transition temperature of the bionanocomposites with increase in clay content. The results of oxygen permeability of the nanocomposite films showed a substantial improvement in oxygen barrier property upon clay loading, which could enable the nanocomposites suitable as packaging materials.