期刊
PLASMA PROCESSES AND POLYMERS
卷 6, 期 4, 页码 246-254出版社
WILEY-V C H VERLAG GMBH
DOI: 10.1002/ppap.200800089
关键词
acrylic acid; deposition rate; plasma polymerization; processing parameter; RF plasma
To perform a systematic study over a broad parameter range of acrylic acid discharges, we varied the energy input W/F over a wide range. Five different regimes could be identified (from low to high energy input): regime I, where oligomerization takes place; regime II, the radical-dominated plasma polymerization of acrylic acid; regime III, a transition regime showing etching/oxidation effects; regime IV, where the plasma polymerization resembles the one observed for CO2/C2H4, discharges; and regime V, where etching effects yield a reduction in deposition rate. These results show that the polymerization mechanism can be described as a function of the energy input W/F. Specifically, a parameter range where acrylic acid can be replaced by CO2/C2H4 discharges has been identified.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据