Effect of modifier and filler concentration on properties of epoxy-red mud waste composite

Purpose - The purpose of this paper is to evaluate the concentration effect of liquid amine terminated poly (ethylene glycol) benzoate (ATPEGB) modifiers and red mud waste filler on mechanical and thermal properties of cured epoxy along with the optimum result of modified epoxy. Design/methodology/approach - For effective toughening, different compositions are made by adding various concentration of ATPEGB to epoxy. The concentration of 2, 5 and 10 parts per 100 parts of epoxy resin of aluminium silicate-based pristine red mud waste is incorporated into each modified epoxy matrix. These filled modified matrixes are cured with ambient temperature curing agent triethylene tetramine and are evaluated with respect to their impact, tensile and flexural strengths. The morphology is analysed by scanning electron microscopy and dynamic mechanical analysis. The thermal stability by thermogravimetric analysis is also reported. Findings - The modification of epoxy resin using ATPEGB and filler shows significant enhancement of mechanical strength over unmodified epoxy. The increase depends on concentration of the modifier and filler. The reason behind this is that in the initial stage of curing the ATPEGB are miscible with the epoxy and form a homogeneous solution. This good mixing promotes the chemical reaction and network formation. During the curing process, as the molecular weight increases, the component separates within the reaction medium to form a second dispersed phase. Research limitations/implications - This paper discusses only ATPEGB synthesised by using poly (ethylene glycol) (PEG) of 200, 400 and 600 and only one filler red mud waste. Besides these, by changing the molecular weight of PEG, other ATPEGB could be synthesised and the efficiency of modification of epoxy resin using these modifiers and other filler besides red mud waste could also be studied. Originality/value - This paper regarding concentration effect of modifier and filler is novel and ATPEGB modified filled epoxy could be used in the fields of coating, casting, adhesives, potting and encapsulation of semiconductor devices.