Solid-liquid interface growth of Cu50Ni50 under deep undercoolings

Molecular dynamics simulations have been performed to explore interface growth of liquid Cu50Ni50 alloy by using an embedded atom potential, namely due to Zhou. The simulated melting temperature is 1585K in agreement well with the experimental value of 1600K. The calculated interface velocity increases with decreasing temperature ranging from 1585K to 1100K, where the calculated values are a little higher than the experimental ones at higher temperatures, and in agreement with the experimental ones at lower temperatures; while the calculated interface velocity decreases with decreasing temperature lower than 1100K. The activation energy of atom is 0.0048eV, almost close to zero under deep undercoolings, although the crystal growth still proceeds with the speed ranging from 50ms(-1) to 10ms(-1). The crystal growth of Cu50Ni50 is not controlled by diffusion mechanism under deep undercoolings.