期刊
PHYSICAL REVIEW B
卷 82, 期 21, 页码 -出版社
AMER PHYSICAL SOC
DOI: 10.1103/PhysRevB.82.214102
关键词
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资金
- Ministry of Education, Culture, Sports, Science and Technology (MEXT) [21686060, 18002009, 22651040]
- Grants-in-Aid for Scientific Research [22651040, 21686060] Funding Source: KAKEN
Hard x-ray diffraction microscopy enables us to observe thick objects at high spatial resolution. The resolution of this method is limited, in principle, by only the x-ray wavelength and the largest scattering angle recorded. As the resolution approaches the wavelength, the thickness effect of objects plays a significant role in x-ray diffraction microscopy. In this paper, we report high-resolution hard x-ray diffraction microscopy for thick objects. We used highly focused coherent x rays with a wavelength of similar to 0.1 nm as an incident beam and measured the diffraction patterns of a similar to 150-nm-thick silver nanocube at the scattering angle of similar to 3 degrees. We observed a characteristic contrast of the coherent diffraction pattern due to only the thickness effect and collected the diffraction patterns at nine incident angles so as to obtain information on a cross section of Fourier space. We reconstructed a pure projection image by the iterative phasing method from the patched diffraction pattern. The edge resolution of the reconstructed image was similar to 2 nm, which was the highest resolution so far achieved by x-ray microscopy. The present study provides us with a method for quantitatively observing thick samples at high resolution by hard x-ray diffraction microscopy.
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