Carbon nanotubes for interconnects in VLSI integrated circuits

The paper reviews the requirements for carbon nanotubes to be used as interconnects in VLSI integrated circuits. It describes the production by chemical vapour deposition of high density arrays of nanotubes suitable for use as interconnects, and describes their characterisation by Raman and transmission electron microscopy. (C) 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim