Strengthening at nanoscaled coherent twin boundary in f.c.c. metals

This paper analyses slip transfer at the boundary of nanoscaled growth twins in face-centred cubic (f.c.c.) metals for strengthening mechanism. The required stress for slip transfer, i.e. inter-twin flow stress, is obtained in a simple expression in terms of stacking fault energy and/or twin boundary (TB) energy, constriction energy and activation volume. For nanotwinned Al, Cu and Ni, inter-twin flow stress versus twin thickness remarkably shows Hall-Petch relationship. The Hall-Petch slope is rationalized for various reactions of screw and non-screw dislocations at the TB. Additionally, strengthening at the boundary of nanoscaled deformation twins in f.c.c. metals is analysed by evaluating required twinning stress. At small nanograin size, the prediction of deformation twin growth stress shows inverse grain-size effect on twinning, in agreement with recent experimental finding.