期刊
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING
卷 93, 期 4, 页码 190-195出版社
TAYLOR & FRANCIS LTD
DOI: 10.1179/0020296715Z.000000000251
关键词
Suppressor; Bottom-up filling; Electroplated copper; Electrochemical measurement; Microvias
资金
- Research Fund for the National Natural Science Foundation of China [21273144]
- Fundamental Research Funds for the Central Universities [GK261001079]
In this paper, the use of polyethylene glycol dodecyl ether (POE) with a molecular weight of 1200 (POE-1200) as a suppressor for bottom-up electroplated copper filling of microvias was investigated. Galvanostatic measurement indicated that POE-1200 had much stronger suppression for Cu electrodeposition than PEG-8000 (polyethylene glycol with a molecular weight of 8000) and EPE-8000 (triblock copolymers of ethylene oxide-propylene oxide-ethylene oxide with a molecular weight of 8000). The strong synergistic suppression between POE-1200 and Cl- led to a very thin surface thickness and excellent filling performance of microvias. The cross-sectional observations of the microvias after electroplated confirmed that changing the POE-1200 concentration from 20 to 700 ppm had little effect on the filling performance because of an unchanged positive potential difference. The adsorption strength of POE-1200 on the cathode surface was enhanced greatly only in the presence of Cl-, attributing to a formation of Cl--Cu+-POE-1200 complex. The critical adsorption concentration of Cl- and POE-1200 to form a saturated barrier film on the electrode surface was studied by Cu stripping peaks of cyclic voltammetry curves. In addition, the relationship between the saturated barrier of Cl--Cu+-POE-1200 complex and the filling performance has been proposed.
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