期刊
THIN SOLID FILMS
卷 597, 期 -, 页码 226-230出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2015.11.068
关键词
Ultrasound; Sonochemistry; Electroless; Copper; Deposition rate; Porosity; Palladium; Printed circuit boards
类别
资金
- IeMRC [SP/02/10/10]
- EPSRC [EP/H03014X/1]
- AGAS Electronic Materials Ltd.
- Graphic Circuits Ltd.
- Solar Capture Technologies Ltd.
- Institute of Materials Finishing
- Institute of Circuit Technology
- EPSRC [EP/H03014X/1] Funding Source: UKRI
- Engineering and Physical Sciences Research Council [EP/H03014X/1] Funding Source: researchfish
The effect that the presence of low-frequency ultrasound has on the deposition rate of an electroless Cu plating process for the metallisation of a Pd activated dielectric material has been preliminarily studied. Continuous ultrasound during electroless Cu plating had little effect on the deposition rate compared with the standard process under mechanical agitation due to the detrimental effect of cavitation on removing Pd from the dielectric materials. However, the introduction of a 'delay time' prior to the introduction of ultrasound resulted in an increase of the deposition rate of up to 26% (7-min delay time) and suggested that low frequency ultrasound could enable a reduction in electroless copper operating temperatures without a significant decrease in plating rate. Cu coatings produced in such conditions exhibited a significantly enhanced surface coverage with reduced porosity without any undesired effect on the crystal structure. (C) 2015 Elsevier B.V. All rights reserved.
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