期刊
THIN SOLID FILMS
卷 584, 期 -, 页码 170-175出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2015.01.007
关键词
Graphene; Copper; Adhesion; Interface; UV/ozone treatment
类别
资金
- Basic Science Research Program - National Research Foundation under the Ministry of Science, ICT & Future Planning, Korea [2012R1A1A1006072]
- Global Frontier R&D Program in the Center for Multiscale Energy System - National Research Foundation under the Ministry of Science, ICT & Future Planning, Korea [2011-0031569]
- Graphene Materials and Components Development Program of MOTIE/KEIT [10044412]
- National Research Foundation of Korea [2012R1A1A1006072] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
The weak adhesion between graphene and its substrate is a potentially significant problem for graphene-based electronic devices. However, quantitative studies on adhesion improvement between graphene and its substrate using simple surface treatments have not yet been reported. In this study, we report the adhesion improvement of the graphene/copper interface using a UV/ozone treatment. The adhesion energy is measured directly using double cantilever beam fracture mechanics testing. A significantly improved adhesion energy of 2.10 +/- 0.27 J/m(2) is achieved with 15 min of UV/ozone treatment; the improved adhesion energy is approximately 200% of that without treatment. The chemical modification of the graphene/copper interface is also characterized using X-ray photoemission spectroscopy (XPS). (C) 2015 Elsevier B.V. All rights reserved.
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