期刊
OPTICS EXPRESS
卷 16, 期 17, 页码 13133-13138出版社
OPTICAL SOC AMER
DOI: 10.1364/OE.16.013133
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资金
- MKE/IITA, Korea [2006-S-073-02]
- National IT Industry Promotion Agency (NIPA), Republic of Korea [2006-S-073-02] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
- National Research Foundation of Korea [과C6A1605] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
We demonstrate a novel on-board chip-to-chip optical interconnect using long-range surface plasmon polariton (LR-SPP) waveguides that feature 2.5-cm-long gold strips embedded in a low loss polymer cladding. A TM-mode vertical-cavity surface-emitting laser (VCSEL) operating at a wavelength of 1.3 mu m was butt-coupled into the waveguides in order to excite a fundamental LR-SPP mode and then the transmitted light was received with a photo-diode (PD). The waveguide width is varied in the range of 1.5-5.0 mu m in order to optimize the insertion loss where the 3-mu m-wide waveguide provides a minimum insertion loss of -17 dB, consisting of 6 dB/cm propagation loss and 2 dB coupling loss. An interconnect system based on the optimized waveguide with a 4-channel array is assembled with the arrayed optoelectronic chips. It shows the feasibility of 10 Gbps (2.5 Gbps x 4 channels) signal transmission indicating that the LR-SPP waveguide is a potential transmission line for optical interconnection. (C) 2008 Optical Society of America.
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