期刊
OPTICS AND LASERS IN ENGINEERING
卷 49, 期 11, 页码 1335-1342出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.optlaseng.2011.05.018
关键词
Digital holography; Digital color holography; Deformation measurement; Image processing; Fringe processing
类别
This paper presents the experimental optical analysis of the crack inside an electronic component. The optical setup is used to carry out multidimensional deformation measurements using digital color holography and the spatial multiplexing of holograms. Since the Fresnel transform method depends on wavelength, a wavelength-dependent-zero-padding algorithm is described and results in a rigorous sizing of each reconstructed monochrome image. The criterion to optimize the parameters is presented and is based on minimizing the widening of the impulse response of the full recording/reconstruction process. The application of the proposed method is illustrated through the analysis of the mechanical deformation of the electronic component, and offers keys to understand its failure mode in industrial conditions. (C) 2011 Elsevier Ltd. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据