期刊
SOLID-STATE ELECTRONICS
卷 113, 期 -, 页码 101-108出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.sse.2015.05.023
关键词
Ultra-thin chips; Hybrid System-in-Foil; Chip warpage; Mechanical stability; Bending stress measurement; Embedded component technology
Electronics embedded in foil is an enabling technology for flexible electronics and for special form factors of electronic components. In contrast to strictly printed electronics, Hybrid Systems-in-Foil (HySiF), comprising thin flexible, embedded chips and large-area thin-film electronic elements, feature a versatile and reliable technological solution for industrial applications of flexible electronics. This paper provides a comprehensive overview of HySiF technology, including aspects of thin-chip fabrication, reliability and assembly. Also presented is an industrial demonstrator utilizing such a HySiF component. (C) 2015 Elsevier Ltd. All rights reserved.
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