期刊
NANOTECHNOLOGY
卷 25, 期 26, 页码 -出版社
IOP PUBLISHING LTD
DOI: 10.1088/0957-4484/25/26/265601
关键词
flash light sintering; copper nanoparticles; copper microparticles
资金
- Basic Science Research Program through the National Research Foundation of Korea (NRF) - Ministry of Education [2012R1A6A1029029]
- National Research Foundation of Korea (NRF) - Korean government (MEST) [2013M2A2A9043280]
- R&D Convergence Program of MSIP (Ministry of Science, ICT and Future Planning)
- ISTK (Korea Research Council for Industrial Science and Technology) of Republic of Korea [B551179-13-02-05]
- Technology Development Program for Strategic Core Materials - Ministry of Trade, Industry & Energy, Republic of Korea [10047758]
- Korea Evaluation Institute of Industrial Technology (KEIT) [10047758] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
- National Research Council of Science & Technology (NST), Republic of Korea [B551179-13-02-05, 융합실용화-13-15-KIMM] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
- National Research Foundation of Korea [2013M2A2A9043280] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
In this study, the size effect of copper particles on the flash light sintering of copper (Cu) ink was investigated using Cu nanoparticles (20-50 nm diameter) and microparticles (2 mu m diameter). Also, the mixed Cu nano-/micro-inks were fabricated, and the synergetic effects between the Cu nano-ink and micro-ink on flash light sintering were assessed. The ratio of nanoparticles to microparticles in Cu ink and the several flash light irradiation conditions (irradiation energy density, pulse number, on-time, and off-time) were optimized to obtain high conductivity of Cu films. In order to precisely monitor the milliseconds-long flash light sintering process, in situ monitoring of electrical resistance and temperature changes of Cu films was conducted during the flash light irradiation using a real-time Wheatstone bridge electrical circuit, thermocouple-based circuit, and a high-rate data acquisition system. Also, several microscopic and spectroscopic characterization techniques such as scanning electron microscopy, x-ray diffraction, x-ray photoelectron spectroscopy, and Fourier transform infrared spectroscopy were used to characterize the flash light sintered Cu nano-/micro-films. In addition, the sheet resistance of Cu film was measured using a four-point probe method. This work revealed that the optimal ratio of nanoparticles to microparticles is 50:50 wt%, and the optimally fabricated and flash light sintered Cu nano-/micro-ink films have the lowest resistivity (80 mu Omega cm) among nanoink, micro-ink, or nano-micro mixed films.
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