相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。Study of the Ge Wafer Surface Hydrophilicity after Low-Temperature Plasma Activation
Xiaobo Ma et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2009)
Role of Heating on Plasma-Activated Silicon Wafers Bonding
M. M. R. Howlader et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2009)
Void-free room-temperature silicon wafer direct bonding using sequential plasma activation
Chenxi Wang et al.
JAPANESE JOURNAL OF APPLIED PHYSICS (2008)
Electrothermal bonding of carbon nanotubes to glass
Sriharsha V. Aradhya et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2008)
Current transport characteristics across shallow hybrid-orientation silicon bonded interfaces
M. C. Wagener et al.
APPLIED PHYSICS LETTERS (2007)
Three-dimensional electrically interconnected nanowire networks formed by diffusion bonding
Zhiyong Gu et al.
LANGMUIR (2007)
Wafer direct bonding:: From advance substrate engineering to future applications in micro/nanoelectronics
Silke H. Christiansen et al.
PROCEEDINGS OF THE IEEE (2006)
Si layer transfer to InP substrate using low-temperature wafer bonding
J. Arokiaraj et al.
APPLIED SURFACE SCIENCE (2006)
Interface resistivity of directly bonded Si wafers
Ikuo Kanno et al.
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS (2006)
Influence of surface roughness on superhydrophobicity
C. Yang et al.
PHYSICAL REVIEW LETTERS (2006)
Room-temperature microfluidics packaging using sequential plasma activation process
M. M. R. Howlader et al.
IEEE TRANSACTIONS ON ADVANCED PACKAGING (2006)
Surface wettabilly of nitrogen plasma-implanted silicon
GJ Wan et al.
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS (2006)
The bonding of nanowire assemblies using adhesive and solder
ZY Gu et al.
JOM (2005)
Characterization and modeling of a microfluidic dielectrophoresis filter for biological species
HB Li et al.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (2005)
Room temperature wafer bonding using oxygen plasma treatment in reactive ion etchers with and without inductively coupled plasma
A Sanz-Velasco et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2003)
Oxide charges induced by plasma activation for wafer bonding
K Schojberg-Henriksen et al.
SENSORS AND ACTUATORS A-PHYSICAL (2002)
Effects of plasma activation on hydrophilic bonding of Si and SiO2
T Suni et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2002)
The analysis of oxygen plasma pretreatment for improving anodic bonding
SW Choi et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2002)
Oxidation and induced damage in oxygen plasma in situ wafer bonding
D Pasquariello et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2000)
Formation of silicon structures by plasma-activated wafer bonding
P Amirfeiz et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2000)