期刊
NANO LETTERS
卷 14, 期 12, 页码 6971-6975出版社
AMER CHEMICAL SOC
DOI: 10.1021/nl503236k
关键词
Thermal transport; thermal radiation; near-field radiation; microelectromechanical systems (MEMS); surface phonon-polariton
类别
资金
- DARPA [FA8650-14-1-7406]
- NSF MRSEC [DMR-1120296]
- National Science Foundation [ECCS-0335765]
- Fonds de recherche du Quebec-Nature et Technologies
Near-field heat transfer recently attracted growing interest but was demonstrated experimentally only in macroscopic systems. However, several projected applications would be relevant mostly in integrated nanostructures. Here we demonstrate a platform for near-field heat transfer on-chip and show that it can be the dominant thermal transport mechanism between integrated nanostructures, overcoming background substrate conduction and the far-field limit (by factors 8 and 7, respectively). Our approach could enable the development of active thermal control devices such as thermal rectifiers and transistors.
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