期刊
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
卷 16, 期 3, 页码 -出版社
IOP PUBLISHING LTD
DOI: 10.1088/1468-6996/16/3/033505
关键词
nanoparticle addition; composite solder; intermetallics compound; lead free solder joint
资金
- Ministry of Higher Education, Malaysia [HIR-MOHE-16001-00-D000001]
- University Malaya [PG069-2013B]
Nanocomposite lead-free solders are gaining prominence as replacements for conventional leadfree solders such as Sn-Ag-Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided.
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