期刊
MICROELECTRONICS RELIABILITY
卷 52, 期 3, 页码 595-602出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.microrel.2011.11.002
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资金
- Seoul RBD program [PA090933]
Functionalized graphene/epoxy composites were prepared using the epoxy resin diglycidyl ether of bisphenol A. Graphene oxide (GO) and Al(OH)(3)-coated graphene (Al-GO) fillers were fabricated using the Hummers method and a simple sol-gel method, with aluminum isopropoxide as the aluminum precursor. X-ray photoelectron spectroscopy verified the successful formation of functional groups onto the GO and Al-GO. The dispersion of functionalized graphene fillers showed an even distribution within the epoxy resins. A dynamic mechanical analysis was used to investigate the changes in the mechanical properties of the epoxy composites, which included neat epoxy and epoxy with various concentrations of graphene-based fillers. The storage modulus and tan delta graphs illustrate the enhancement achieved by increasing the amount of filler. The composite with 3 wt.% GO had the highest storage modulus and glass transition temperature. The thermal conductivities of the composites with graphene-based fillers were enhanced compared to those without fillers. The 3 wt.% GO/epoxy composite had the highest thermal conductivity, which was nearly twice that of the neat epoxy resin. (C) 2011 Elsevier Ltd. All rights reserved.
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