期刊
APPLIED THERMAL ENGINEERING
卷 81, 期 -, 页码 10-17出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.applthermaleng.2015.02.012
关键词
C/SiC lattice sandwich panel; Heat transfer; Finite element simulation; Equivalent thermal conductivity
资金
- National Natural Science Foundation of China [11402003, 11227801, 90816025]
- National Basic Research Program of China [G2010CB832701, 2011CB610303, 2011CB606105]
Lightweight C/SiC pyramidal core lattice sandwich panel was proposed and fabricated for potential applications as hot structure and thermal protection system (TPS). The heat transfer characteristics of C/SiC lattice sandwich panel were measured from 600 to 1150 degrees C through an aerodynamic heating simulation experimental system. Temperature distribution on the back surface of the lattice sandwich panel was obtained through periodical thermocouple assignment. Heat insulation effects under different temperatures were also investigated. Finally, a three dimensional finite element simulation model was built to calculate the heat transfer of the C/SiC lattice sandwich panel. The equivalent thermal conductivity of the C/SiC lattice sandwich panel varied from 1.98 to 4.95 W/(m degrees C) when the front surface temperature increased from 600 to 1150 degrees C. It is believed that these results can provide a foundational understanding on the heat transfer characteristics of C/SiC lattice sandwich panel. (C) 2015 Elsevier Ltd. All rights reserved.
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