期刊
MICROELECTRONICS RELIABILITY
卷 52, 期 9-10, 页码 2336-2341出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.microrel.2012.06.031
关键词
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Active cycling of power devices, i.e. exposure to repetitive voltage and current pulses, causes power dissipation, resulting in thermo-mechanical loads that can cause different failure mechanisms. This paper focuses on degradation of the metallization. Requirements and customer expectations, using examples from automotive applications, are discussed, contrasting these with the procedures for reliability assessment and their limitations. (C) 2012 Elsevier Ltd. All rights reserved.
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