期刊
MICROELECTRONICS RELIABILITY
卷 48, 期 7, 页码 1033-1039出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.microrel.2008.04.009
关键词
-
This paper presents a fundamental assessment of pressure-induced tin whisker formation. A creep-based tin whisker model was developed to explain experimental data as well as data from industrial studies. A grain boundary diffusion model was then developed to predict a maximum whisker length. It is shown that creep properties obtained from samples can be used to screen plating finishes susceptible to tin whiskering. This enables a manufacturer to assess tin whisker risks prior to volume production. (C) 2008 Elsevier Ltd. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据